TY - GEN
T1 - 1.2GFLOPS neural network chip exhibiting fast convergence
AU - Kondo, Yoshikazu
AU - Koshiba, Yuichi
AU - Arima, Yutaka
AU - Murasaki, Mitsuhiro
AU - Yamada, Tuyoshi
AU - Amishiro, Hiroyuki
AU - Shinohara, Hirofumi
AU - Mori, Hakuro
N1 - Copyright:
Copyright 2003 Elsevier Science B.V., Amsterdam. All rights reserved.
PY - 1994
Y1 - 1994
N2 - This paper describes a digital neural network chip for use as core in neural network accelerators employs a single-instruction multi-data-stream (SIMD architecture and includes twelve 24b floating-point processing units (PUs), a nonlinear function unit (NFU), and a control unit (CU). Each PU includes 24b×1.28kw local memory and communicates with its neighbor through a shift register ring. This configuration permits both feed-forward and error back propagation (BP) processes to be executed efficiently. The CU, which includes a three stage pipelined sequencer, a 24b×1kw instruction code memory (ICM) and a 144b×256w microcode memory (MCM), broadcasts network parameters (e.g., learning coefficients or temperature parameters) or addresses for local memories through a data and an address bus. Two external memory ports and a ring expansion-port permit large networks to be constructed. The external memory can be expanded by up to 768kW using the two ports.
AB - This paper describes a digital neural network chip for use as core in neural network accelerators employs a single-instruction multi-data-stream (SIMD architecture and includes twelve 24b floating-point processing units (PUs), a nonlinear function unit (NFU), and a control unit (CU). Each PU includes 24b×1.28kw local memory and communicates with its neighbor through a shift register ring. This configuration permits both feed-forward and error back propagation (BP) processes to be executed efficiently. The CU, which includes a three stage pipelined sequencer, a 24b×1kw instruction code memory (ICM) and a 144b×256w microcode memory (MCM), broadcasts network parameters (e.g., learning coefficients or temperature parameters) or addresses for local memories through a data and an address bus. Two external memory ports and a ring expansion-port permit large networks to be constructed. The external memory can be expanded by up to 768kW using the two ports.
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M3 - Conference contribution
AN - SCOPUS:0028124015
SN - 0780318455
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 218
EP - 219
BT - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
A2 - Anon, null
PB - Publ by IEEE
T2 - Proceedings of the 1994 IEEE International Solid-State Circuits Conference
Y2 - 16 February 1994 through 18 February 1994
ER -