300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface

S. Hara, K. Takano, K. Katayama, R. Dong, K. Mizuno, K. Takahashi, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Citations (Scopus)


A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.

Original languageEnglish
Title of host publication2018 48th European Microwave Conference, EuMC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages4
ISBN (Electronic)9782874870514
Publication statusPublished - 2018 Nov 20
Externally publishedYes
Event48th European Microwave Conference, EuMC 2018 - Madrid, Spain
Duration: 2018 Sept 252018 Sept 27

Publication series

Name2018 48th European Microwave Conference, EuMC 2018


Other48th European Microwave Conference, EuMC 2018


  • 300-GHz band
  • CMOS
  • receiver module
  • terahertz wave
  • waveguide transition

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Instrumentation
  • Radiation


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