3.5W HBT MMIC power amplifier module for mobile communications

Keiichi Sakuno; Masanori Akagi; Hiroya Sato; Masato Miyauchi; Masatomo Hasegawa; Toshihiko Yoshimasu; Shinji Hara

3.5W HBT MMIC power amplifier module for mobile communications

Keiichi Sakuno^*, Masanori Akagi, Hiroya Sato, Masato Miyauchi, Masatomo Hasegawa, Toshihiko Yoshimasu, Shinji Hara

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

16 Citations (Scopus)

Abstract

A 900MHz-band GaAs/GaAlAs HBT MMIC power amplifier module has been developed for mobile communications by using a novel assembly technique called BHS and an AIN package as the MMIC chip carrier. The power module gave a peak output power of 3.7W and a power-added efficiency of 54.5% with a +6V single supply voltage.

Original language	English
Title of host publication	Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium
Publisher	Publ by IEEE
Pages	63-66
Number of pages	4
ISBN (Print)	0780314190
Publication status	Published - 1994 Jan 1
Externally published	Yes
Event	Proceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium - San Diego, CA, USA Duration: 1994 May 23 → 1994 May 25

Publication series

Name	Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium
ISSN (Print)	0074-8587

Other

Other	Proceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium
City	San Diego, CA, USA
Period	94/5/23 → 94/5/25

ASJC Scopus subject areas

Engineering(all)

Cite this

3.5W HBT MMIC power amplifier module for mobile communications. / Sakuno, Keiichi; Akagi, Masanori; Sato, Hiroya et al.
Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium. Publ by IEEE, 1994. p. 63-66 (Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Sakuno, K, Akagi, M, Sato, H, Miyauchi, M, Hasegawa, M, Yoshimasu, T & Hara, S 1994, 3.5W HBT MMIC power amplifier module for mobile communications. in Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium, Publ by IEEE, pp. 63-66, Proceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium, San Diego, CA, USA, 94/5/23.

@inproceedings{194348d1d46b4eb293153d3fe5835d47,

title = "3.5W HBT MMIC power amplifier module for mobile communications",

abstract = "A 900MHz-band GaAs/GaAlAs HBT MMIC power amplifier module has been developed for mobile communications by using a novel assembly technique called BHS and an AIN package as the MMIC chip carrier. The power module gave a peak output power of 3.7W and a power-added efficiency of 54.5% with a +6V single supply voltage.",

author = "Keiichi Sakuno and Masanori Akagi and Hiroya Sato and Masato Miyauchi and Masatomo Hasegawa and Toshihiko Yoshimasu and Shinji Hara",

year = "1994",

month = jan,

day = "1",

language = "English",

isbn = "0780314190",

series = "Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium",

publisher = "Publ by IEEE",

pages = "63--66",

booktitle = "Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium",

note = "Proceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium ; Conference date: 23-05-1994 Through 25-05-1994",

}

TY - GEN

T1 - 3.5W HBT MMIC power amplifier module for mobile communications

AU - Sakuno, Keiichi

AU - Akagi, Masanori

AU - Sato, Hiroya

AU - Miyauchi, Masato

AU - Hasegawa, Masatomo

AU - Yoshimasu, Toshihiko

AU - Hara, Shinji

PY - 1994/1/1

Y1 - 1994/1/1

N2 - A 900MHz-band GaAs/GaAlAs HBT MMIC power amplifier module has been developed for mobile communications by using a novel assembly technique called BHS and an AIN package as the MMIC chip carrier. The power module gave a peak output power of 3.7W and a power-added efficiency of 54.5% with a +6V single supply voltage.

AB - A 900MHz-band GaAs/GaAlAs HBT MMIC power amplifier module has been developed for mobile communications by using a novel assembly technique called BHS and an AIN package as the MMIC chip carrier. The power module gave a peak output power of 3.7W and a power-added efficiency of 54.5% with a +6V single supply voltage.

UR - http://www.scopus.com/inward/record.url?scp=0028045810&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028045810&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0028045810

SN - 0780314190

T3 - Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium

SP - 63

EP - 66

BT - Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium

PB - Publ by IEEE

T2 - Proceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium

Y2 - 23 May 1994 through 25 May 1994

ER -

3.5W HBT MMIC power amplifier module for mobile communications

Abstract

Publication series

Other

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this