60 GHz multi-chip module based on cost effective hybrid multilayer PWB

Sung Tae Choi; Kiyoshi Hamaguchi; Hiroyo Ogawa; Kiyohito Tokuda; Yong Hoon Kim

doi:10.1002/mop.22719

60 GHz multi-chip module based on cost effective hybrid multilayer PWB

Sung Tae Choi^*, Kiyoshi Hamaguchi, Hiroyo Ogawa, Kiyohito Tokuda, Yong Hoon Kim

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

A novel cost-effective 60-GHz multi-chip module (MCM) is proposed and demonstrated. It is based on a low-cost multilayer printed wiring board (PWB) with a novel vertical transition and a single layer waveguide transition which enables the use of low-cost substrates with high dielectric loss for millimeter wave applications. The proposed MCM technology has been successfolly applied to the packaging of a 60-GHz self-heterodyne mixer, and no substantial difference in the RF performance is observed with the packaging.

Original language	English
Pages (from-to)	2303-2305
Number of pages	3
Journal	Microwave and Optical Technology Letters
Volume	49
Issue number	9
DOIs	https://doi.org/10.1002/mop.22719
Publication status	Published - 2007 Sept
Externally published	Yes

Keywords

Interconnections
Millimeter wave
Multi-chip module (MCM)
Multilayer printed wiring board (PWB)
Via holes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1002/mop.22719

Cite this

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title = "60 GHz multi-chip module based on cost effective hybrid multilayer PWB",

abstract = "A novel cost-effective 60-GHz multi-chip module (MCM) is proposed and demonstrated. It is based on a low-cost multilayer printed wiring board (PWB) with a novel vertical transition and a single layer waveguide transition which enables the use of low-cost substrates with high dielectric loss for millimeter wave applications. The proposed MCM technology has been successfolly applied to the packaging of a 60-GHz self-heterodyne mixer, and no substantial difference in the RF performance is observed with the packaging.",

keywords = "Interconnections, Millimeter wave, Multi-chip module (MCM), Multilayer printed wiring board (PWB), Via holes",

author = "Choi, {Sung Tae} and Kiyoshi Hamaguchi and Hiroyo Ogawa and Kiyohito Tokuda and Kim, {Yong Hoon}",

year = "2007",

month = sep,

doi = "10.1002/mop.22719",

language = "English",

volume = "49",

pages = "2303--2305",

journal = "Microwave and Optical Technology Letters",

issn = "0895-2477",

publisher = "John Wiley and Sons Inc.",

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TY - JOUR

T1 - 60 GHz multi-chip module based on cost effective hybrid multilayer PWB

AU - Choi, Sung Tae

AU - Hamaguchi, Kiyoshi

AU - Ogawa, Hiroyo

AU - Tokuda, Kiyohito

AU - Kim, Yong Hoon

PY - 2007/9

Y1 - 2007/9

N2 - A novel cost-effective 60-GHz multi-chip module (MCM) is proposed and demonstrated. It is based on a low-cost multilayer printed wiring board (PWB) with a novel vertical transition and a single layer waveguide transition which enables the use of low-cost substrates with high dielectric loss for millimeter wave applications. The proposed MCM technology has been successfolly applied to the packaging of a 60-GHz self-heterodyne mixer, and no substantial difference in the RF performance is observed with the packaging.

AB - A novel cost-effective 60-GHz multi-chip module (MCM) is proposed and demonstrated. It is based on a low-cost multilayer printed wiring board (PWB) with a novel vertical transition and a single layer waveguide transition which enables the use of low-cost substrates with high dielectric loss for millimeter wave applications. The proposed MCM technology has been successfolly applied to the packaging of a 60-GHz self-heterodyne mixer, and no substantial difference in the RF performance is observed with the packaging.

KW - Interconnections

KW - Millimeter wave

KW - Multi-chip module (MCM)

KW - Multilayer printed wiring board (PWB)

KW - Via holes

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U2 - 10.1002/mop.22719

DO - 10.1002/mop.22719

M3 - Article

AN - SCOPUS:34547659224

SN - 0895-2477

VL - 49

SP - 2303

EP - 2305

JO - Microwave and Optical Technology Letters

JF - Microwave and Optical Technology Letters

IS - 9

ER -

60 GHz multi-chip module based on cost effective hybrid multilayer PWB

Abstract

Keywords

ASJC Scopus subject areas

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