8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

S. Kanazawa; T. Fujisawa; K. Takahata; H. Sanjoh; R. Iga; H. Ishii

doi:10.1109/ISLC.2014.162

8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

S. Kanazawa, T. Fujisawa, K. Takahata, H. Sanjoh, R. Iga, H. Ishii

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.

Original language	English
Title of host publication	Conference Digest - IEEE International Semiconductor Laser Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	58-59
Number of pages	2
ISBN (Electronic)	9781479957217
DOIs	https://doi.org/10.1109/ISLC.2014.162
Publication status	Published - 2014 Dec 16
Externally published	Yes
Event	2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014 - Palma de Mallorca, Spain Duration: 2014 Sept 7 → 2014 Sept 10

Publication series

Name	Conference Digest - IEEE International Semiconductor Laser Conference
ISSN (Print)	0899-9406

Other

Other	2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014
Country/Territory	Spain
City	Palma de Mallorca
Period	14/9/7 → 14/9/10

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

Access to Document

10.1109/ISLC.2014.162

Cite this

Kanazawa, S., Fujisawa, T., Takahata, K., Sanjoh, H., Iga, R., & Ishii, H. (2014). 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. In Conference Digest - IEEE International Semiconductor Laser Conference (pp. 58-59). Article 6987449 (Conference Digest - IEEE International Semiconductor Laser Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISLC.2014.162

8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. / Kanazawa, S.; Fujisawa, T.; Takahata, K. et al.
Conference Digest - IEEE International Semiconductor Laser Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 58-59 6987449 (Conference Digest - IEEE International Semiconductor Laser Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kanazawa, S, Fujisawa, T, Takahata, K, Sanjoh, H, Iga, R & Ishii, H 2014, 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. in Conference Digest - IEEE International Semiconductor Laser Conference., 6987449, Conference Digest - IEEE International Semiconductor Laser Conference, Institute of Electrical and Electronics Engineers Inc., pp. 58-59, 2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014, Palma de Mallorca, Spain, 14/9/7. https://doi.org/10.1109/ISLC.2014.162

Kanazawa S, Fujisawa T, Takahata K, Sanjoh H, Iga R, Ishii H. 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. In Conference Digest - IEEE International Semiconductor Laser Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 58-59. 6987449. (Conference Digest - IEEE International Semiconductor Laser Conference). doi: 10.1109/ISLC.2014.162

@inproceedings{3678fe37e27244aa99398a915b805c47,

title = "8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique",

abstract = "We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.",

author = "S. Kanazawa and T. Fujisawa and K. Takahata and H. Sanjoh and R. Iga and H. Ishii",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014 ; Conference date: 07-09-2014 Through 10-09-2014",

year = "2014",

month = dec,

day = "16",

doi = "10.1109/ISLC.2014.162",

language = "English",

series = "Conference Digest - IEEE International Semiconductor Laser Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "58--59",

booktitle = "Conference Digest - IEEE International Semiconductor Laser Conference",

}

TY - GEN

T1 - 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

AU - Kanazawa, S.

AU - Fujisawa, T.

AU - Takahata, K.

AU - Sanjoh, H.

AU - Iga, R.

AU - Ishii, H.

PY - 2014/12/16

Y1 - 2014/12/16

N2 - We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.

AB - We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.

UR - http://www.scopus.com/inward/record.url?scp=84920149893&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84920149893&partnerID=8YFLogxK

U2 - 10.1109/ISLC.2014.162

DO - 10.1109/ISLC.2014.162

M3 - Conference contribution

AN - SCOPUS:84920149893

T3 - Conference Digest - IEEE International Semiconductor Laser Conference

SP - 58

EP - 59

BT - Conference Digest - IEEE International Semiconductor Laser Conference

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014

Y2 - 7 September 2014 through 10 September 2014

ER -

8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this