A 600MIPS 120mW 70μA leakage triple-CPU mobile application processor chip

S. Torii; S. Suzuki; H. Tomonaga; T. Tokue; J. Sakai; N. Suzuki; K. Murakami; T. Hiraga; K. Shigemoto; Y. Tatebe; E. Ohbuchi; N. Kayama; M. Edahiro; T. Kusano; N. Nishi

A 600MIPS 120mW 70μA leakage triple-CPU mobile application processor chip

S. Torii^*, S. Suzuki, H. Tomonaga, T. Tokue, J. Sakai, N. Suzuki, K. Murakami, T. Hiraga, K. Shigemoto, Y. Tatebe, E. Ohbuchi, N. Kayama, M. Edahiro, T. Kusano, N. Nishi

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

36 Citations (Scopus)

Original language	English
Pages (from-to)	136-137+589
Journal	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume	48
Publication status	Published - 2005
Externally published	Yes
Event	2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States Duration: 2005 Feb 6 → 2005 Feb 10

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

@article{523a4fd0a59e4dae87eab777da64edbd,

title = "A 600MIPS 120mW 70μA leakage triple-CPU mobile application processor chip",

author = "S. Torii and S. Suzuki and H. Tomonaga and T. Tokue and J. Sakai and N. Suzuki and K. Murakami and T. Hiraga and K. Shigemoto and Y. Tatebe and E. Ohbuchi and N. Kayama and M. Edahiro and T. Kusano and N. Nishi",

year = "2005",

language = "English",

volume = "48",

pages = "136--137+589",

journal = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

issn = "0193-6530",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2005 IEEE International Solid-State Circuits Conference, ISSCC ; Conference date: 06-02-2005 Through 10-02-2005",

}

TY - JOUR

T1 - A 600MIPS 120mW 70μA leakage triple-CPU mobile application processor chip

AU - Torii, S.

AU - Suzuki, S.

AU - Tomonaga, H.

AU - Tokue, T.

AU - Sakai, J.

AU - Suzuki, N.

AU - Murakami, K.

AU - Hiraga, T.

AU - Shigemoto, K.

AU - Tatebe, Y.

AU - Ohbuchi, E.

AU - Kayama, N.

AU - Edahiro, M.

AU - Kusano, T.

AU - Nishi, N.

PY - 2005

Y1 - 2005

UR - http://www.scopus.com/inward/record.url?scp=27244443947&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=27244443947&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:27244443947

SN - 0193-6530

VL - 48

SP - 136-137+589

JO - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

JF - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

T2 - 2005 IEEE International Solid-State Circuits Conference, ISSCC

Y2 - 6 February 2005 through 10 February 2005

ER -

A 600MIPS 120mW 70μA leakage triple-CPU mobile application processor chip

ASJC Scopus subject areas

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Cite this