A disposable, dead volume-free and leak-free monolithic PDMS microvalve

Jeung Sang Go, T. Yamazaki, M. Kanai, H. Sato, S. Kawakami, S. Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

A new fabrication method of a membrane-inserted pneumatically-driven microvalve is presented. The device is entirely made from PDMS. To ensure dead volume-free and leak-free, the valve chamber is formed with smooth surface using molding of UV-curable bond. Also, to place a PDMS membrane on the molded PDMS substrate, bonding with spin-coated PDMS membrane is performed, indicating to align-less assembly. As a reference of bonding characterization, the curing ratio, defined as the ratio of soft bake time and hard cure time of PDMS at the same soft cure temperature, is introduced. The best bonding feature is obtained at the curing ratio of 0.06. The maximum tensile bonding strength is examined. Finally, the performance of the membrane-inserted monolithic PDMS valve is tested.

Original languageEnglish
Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages643-646
Number of pages4
ISBN (Electronic)0780377311, 9780780377318
DOIs
Publication statusPublished - 2003 Jan 1
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
Duration: 2003 Jun 82003 Jun 12

Publication series

NameTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume1

Other

Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
Country/TerritoryUnited States
CityBoston
Period03/6/803/6/12

Keywords

  • Bonding
  • Curing
  • Fabrication
  • Glass
  • Microchannel
  • Microfluidics
  • Microvalves
  • Optical surface waves
  • Silicon
  • Valves

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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