A haptic-based perception-empathy biofeedback device that supplements foot pressure pattern during gait in stroke patients

Yuki Hayashi, Kazuhiro Yasuda, Yu Kitaji, Hiroaki Harashima, Hiroyasu Iwata*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The present study introduces a haptic-based biofeedback device that supplements the foot pressure information of a paretic foot using a wearable vibrotactile biofeedback device attached to the back. This system provides information pertaining to the hemiplegic patient's foot pressure pattern, both to the patient and the physical therapist. To verify the effect of the device, a 3-week pilot clinical trial was conducted on six patients (mean age: 56.8 ±11.4 years). Intervention was performed three times a week. After the intervention training, we observed significant improvement in stride length of the unparalyzed leg (p=0.0277). Moreover, the plantar flexion angle of the paralyzed side showed marginal improvement (p=0.0747). These results suggest that this device has the potential to improve the efficiency of push off function. However, the device did not improve ankle dorsiflexion of the paralyzed side, cadence and the walking speed. We speculate that the device, to some extent, imposed a cognitive burden, which may have interfered with the change in specific joint movements and limited its impact on comprehensive walking ability.

Original languageEnglish
Title of host publicationProceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages124-128
Number of pages5
ISBN (Electronic)9781538636152
DOIs
Publication statusPublished - 2019 Apr 25
Event2019 IEEE/SICE International Symposium on System Integration, SII 2019 - Paris, France
Duration: 2019 Jan 142019 Jan 16

Publication series

NameProceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019

Conference

Conference2019 IEEE/SICE International Symposium on System Integration, SII 2019
Country/TerritoryFrance
CityParis
Period19/1/1419/1/16

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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