A kinetic equation for thermal oxidation of silicon replacing the Deal-Grove equation

Takanobu Watanabe*, Iwao Ohdomari

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


A formulated kinetic theory for thermal oxidation of silicon is presented in detail. The theory does not involve the rate-limiting step of the interfacial oxidation reaction, instead it is supposed that the diffusivity is suppressed in a strained oxide region near the Si O2 Si interface. The expression of the parabolic constant is the same as that of the Deal-Grove model, while the linear constant makes a clear distinction with the model. The estimated thickness using the expression is close to 1 nm, which compares well with the thickness of the structural transition layer. The origin of the deviation from the linear-parabolic relationship observed at initial oxidation stages can be explained by the enhanced diffusion hypothesis, which is the opposite conclusion to the Deal-Grove theory.

Original languageEnglish
Pages (from-to)G270-G276
JournalJournal of the Electrochemical Society
Issue number12
Publication statusPublished - 2007 Nov 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry


Dive into the research topics of 'A kinetic equation for thermal oxidation of silicon replacing the Deal-Grove equation'. Together they form a unique fingerprint.

Cite this