TY - GEN
T1 - A Novel Lateral Reverse Conducting Trench IGBT on SOI employing NPN bipolar with small area penalty and switching energy loss
AU - Liu, Suyang
AU - Zhang, Yue
AU - Zhang, Zijian
AU - Inuishi, Masahide
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - We propose a novel design of N-channel Reverse Conducting lateral IGBT (RC-LIGBT) based on silicon-on-insulator (SOI) technology with replacing an N+ anode by an NPN bipolar in the embedded diode region. The snap-back effect can be suppressed drastically by the proposed structure with simple fabrication process using one additional masking step of ion implantation as verified by the process and the device simulation. The use of trench structure and injection control drastically improves the trade of relationship between the turn-off energy loss and the structure shows the dynamic and the static forward blocking voltage of nearly 400V. The proposed structure has stronger thermal stability and can reduce the area penalty compared with the other structures ever reported.
AB - We propose a novel design of N-channel Reverse Conducting lateral IGBT (RC-LIGBT) based on silicon-on-insulator (SOI) technology with replacing an N+ anode by an NPN bipolar in the embedded diode region. The snap-back effect can be suppressed drastically by the proposed structure with simple fabrication process using one additional masking step of ion implantation as verified by the process and the device simulation. The use of trench structure and injection control drastically improves the trade of relationship between the turn-off energy loss and the structure shows the dynamic and the static forward blocking voltage of nearly 400V. The proposed structure has stronger thermal stability and can reduce the area penalty compared with the other structures ever reported.
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U2 - 10.1109/EDTM53872.2022.9798192
DO - 10.1109/EDTM53872.2022.9798192
M3 - Conference contribution
AN - SCOPUS:85133965657
T3 - 6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022
SP - 204
EP - 206
BT - 6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022
Y2 - 6 March 2022 through 9 March 2022
ER -