A novel lift off process and its application for capacitive tilt sensor

Jinxing Liang*, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)


    This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

    Original languageEnglish
    Title of host publicationProceedings of IEEE Sensors
    Number of pages4
    Publication statusPublished - 2006
    Event2006 5th IEEE Conference on Sensors - Daegu
    Duration: 2006 Oct 222006 Oct 25


    Other2006 5th IEEE Conference on Sensors

    ASJC Scopus subject areas

    • Engineering (miscellaneous)
    • Electrical and Electronic Engineering


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