A novel lift off process and its application for capacitive tilt sensor

Jinxing Liang; Fusao Kohsaka; Takahiro Matsuo; Toshitsugu Ueda

doi:10.1109/ICSENS.2007.355899

A novel lift off process and its application for capacitive tilt sensor

Jinxing Liang^*, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

Original language	English
Title of host publication	Proceedings of IEEE Sensors
Pages	1422-1425
Number of pages	4
DOIs	https://doi.org/10.1109/ICSENS.2007.355899
Publication status	Published - 2006
Event	2006 5th IEEE Conference on Sensors - Daegu Duration: 2006 Oct 22 → 2006 Oct 25

Other

Other	2006 5th IEEE Conference on Sensors
City	Daegu
Period	06/10/22 → 06/10/25

ASJC Scopus subject areas

Engineering (miscellaneous)
Electrical and Electronic Engineering

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10.1109/ICSENS.2007.355899

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@inproceedings{82cbac18452c493893e96ce21ddb87a1,

title = "A novel lift off process and its application for capacitive tilt sensor",

abstract = "This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.",

author = "Jinxing Liang and Fusao Kohsaka and Takahiro Matsuo and Toshitsugu Ueda",

year = "2006",

doi = "10.1109/ICSENS.2007.355899",

language = "English",

isbn = "1424403766",

pages = "1422--1425",

booktitle = "Proceedings of IEEE Sensors",

note = "2006 5th IEEE Conference on Sensors ; Conference date: 22-10-2006 Through 25-10-2006",

}

TY - GEN

T1 - A novel lift off process and its application for capacitive tilt sensor

AU - Liang, Jinxing

AU - Kohsaka, Fusao

AU - Matsuo, Takahiro

AU - Ueda, Toshitsugu

PY - 2006

Y1 - 2006

N2 - This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

AB - This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

UR - http://www.scopus.com/inward/record.url?scp=50149119272&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=50149119272&partnerID=8YFLogxK

U2 - 10.1109/ICSENS.2007.355899

DO - 10.1109/ICSENS.2007.355899

M3 - Conference contribution

AN - SCOPUS:50149119272

SN - 1424403766

SN - 9781424403769

SP - 1422

EP - 1425

BT - Proceedings of IEEE Sensors

T2 - 2006 5th IEEE Conference on Sensors

Y2 - 22 October 2006 through 25 October 2006

ER -

A novel lift off process and its application for capacitive tilt sensor

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