TY - GEN
T1 - A parallel routing method for fixed pins using virtual boundary
AU - Zhang, Ran
AU - Watanabe, Takahiro
PY - 2013/9/16
Y1 - 2013/9/16
N2 - In recent PCB systems, the routing for high speed board is still achieved manually. As IC technology advances rapidly, the dimensions of packages and PCBs are decreasing while the pin counts and routing layers keep increasing. In this research, a parallel routing method for fixed pins using virtual boundary is proposed, which partitions the routing area into several sub-areas and routes them separately. Applying this proposed method, the wire length can be reduced. Moreover, considering the length-matching constraints, especially for the isometric wires routing problems, the proposed method can get better wire shape resemblance.
AB - In recent PCB systems, the routing for high speed board is still achieved manually. As IC technology advances rapidly, the dimensions of packages and PCBs are decreasing while the pin counts and routing layers keep increasing. In this research, a parallel routing method for fixed pins using virtual boundary is proposed, which partitions the routing area into several sub-areas and routes them separately. Applying this proposed method, the wire length can be reduced. Moreover, considering the length-matching constraints, especially for the isometric wires routing problems, the proposed method can get better wire shape resemblance.
KW - PCB routing
KW - parallel wires
KW - virtual boundary
UR - http://www.scopus.com/inward/record.url?scp=84883686641&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84883686641&partnerID=8YFLogxK
U2 - 10.1109/TENCONSpring.2013.6584425
DO - 10.1109/TENCONSpring.2013.6584425
M3 - Conference contribution
AN - SCOPUS:84883686641
SN - 9781467363495
T3 - IEEE 2013 Tencon - Spring, TENCONSpring 2013 - Conference Proceedings
SP - 99
EP - 103
BT - IEEE 2013 Tencon - Spring, TENCONSpring 2013 - Conference Proceedings
T2 - 2013 1st IEEE TENCON Spring Conference, TENCONSpring 2013
Y2 - 17 April 2013 through 19 April 2013
ER -