Abstract
Extensively used in electronics application are electroplating and electroless-plating methods. The printed wiring boards (PWB), in order to raise the packing density, uses both techniques to employ higher multi-layer and higher surface density. Described in the paper is advanced surface finishing in electronics application. Plating technique has become an important key technology in this field. Its increased usage and applications are seen to take place in the future.
| Original language | English |
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| Pages | 421-424 |
| Number of pages | 4 |
| Publication status | Published - 1993 Dec 1 |
| Event | Proceedings of the 80th AESF Annual Technical Conference - Anaheim, CA, USA Duration: 1993 Jun 21 → 1993 Jun 24 |
Other
| Other | Proceedings of the 80th AESF Annual Technical Conference |
|---|---|
| City | Anaheim, CA, USA |
| Period | 93/6/21 → 93/6/24 |
ASJC Scopus subject areas
- Mechanical Engineering
- Metals and Alloys