Advancement of analysis method for electromagnetic screening effect of viaducts for railway

Tamio Okutani*, Nobuyuki Nakamura, Natsuki Terada, Yutaka Tate, Satoshi Inada, Tomoyuki Ogawa, Yoshio Son, Shinji Wakao

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


New method to estimate electromagnetic screening effect of rigid frame viaducts has been developed. Mutual relationship among the effects of electrical connecting manner of girding bridges; conductivity of the ground; and harmonic frequency was identified theoretically and numerically based on the results of multiple conductor circuit model simulations and field measurements using over 3km length test cables set on a viaduct section of Shinkansen line under construction. Adding, developed modeling method to simplify the equivalent circuit of vast amount of steel bars in the reinforced concrete accelerates the estimation process with enough accuracy. As the result, it became easy to calculate the induced voltage in the cables or in the track circuits with enough accuracy.

Original languageEnglish
Pages (from-to)310-320+20
Journalieej transactions on industry applications
Issue number3
Publication statusPublished - 2008


  • Electromagnetic interference
  • Multiple conductor circuit
  • Railway
  • Screening effect
  • Viaduct

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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