An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces

Hiroki Yasuga; Atsushi Eda; Kai Suto; Tomohiro Tachi; Eiji Iwase

doi:10.1109/MEMS46641.2020.9056110

An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces

Hiroki Yasuga, Atsushi Eda, Kai Suto, Tomohiro Tachi, Eiji Iwase^*

^*Corresponding author for this work

School of Fundamental Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding ('Origami') or cutting ('Kirigami') of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.

Original language	English
Title of host publication	33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	909-912
Number of pages	4
ISBN (Electronic)	9781728135809
DOIs	https://doi.org/10.1109/MEMS46641.2020.9056110
Publication status	Published - 2020 Jan
Event	33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 - Vancouver, Canada Duration: 2020 Jan 18 → 2020 Jan 22

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2020-January
ISSN (Print)	1084-6999

Conference

Conference	33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Country/Territory	Canada
City	Vancouver
Period	20/1/18 → 20/1/22

Keywords

Extruded Miura-Ori
Flexible electronic devices
Origami
Self-folding

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/MEMS46641.2020.9056110

Cite this

Yasuga, H., Eda, A., Suto, K., Tachi, T., & Iwase, E. (2020). An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces. In 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 (pp. 909-912). [9056110] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2020-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS46641.2020.9056110

An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces. / Yasuga, Hiroki; Eda, Atsushi; Suto, Kai et al.
33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 909-912 9056110 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2020-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yasuga, H, Eda, A, Suto, K, Tachi, T & Iwase, E 2020, An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces. in 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020., 9056110, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2020-January, Institute of Electrical and Electronics Engineers Inc., pp. 909-912, 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020, Vancouver, Canada, 20/1/18. https://doi.org/10.1109/MEMS46641.2020.9056110

Yasuga H, Eda A, Suto K, Tachi T, Iwase E. An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces. In 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 909-912. 9056110. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMS46641.2020.9056110

Yasuga, Hiroki ; Eda, Atsushi ; Suto, Kai et al. / An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces. 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Institute of Electrical and Electronics Engineers Inc., 2020. pp. 909-912 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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abstract = "We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding ('Origami') or cutting ('Kirigami') of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.",

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author = "Hiroki Yasuga and Atsushi Eda and Kai Suto and Tomohiro Tachi and Eiji Iwase",

note = "Funding Information: This work was partially supported by JSPS KAKENHI Grant Number 18H03868 and “EarlyBird” grant for young researcher at Waseda Research Institute for Science and Engineering. Publisher Copyright: {\textcopyright} 2020 IEEE.; 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 ; Conference date: 18-01-2020 Through 22-01-2020",

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AU - Iwase, Eiji

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N2 - We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding ('Origami') or cutting ('Kirigami') of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.

AB - We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding ('Origami') or cutting ('Kirigami') of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.

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An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces

Abstract

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Keywords

ASJC Scopus subject areas

Access to Document

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