Abstract
The newly designed scheme for a low-voltage 16 MDRAM/SOI has been successfully realized and the functional DRAM operation has been obtained at very low supply voltage below 1 V. The key process and circuit technologies for low-voltage/high-speed SOI-DRAM will be described here. The extra low voltage DRAM technologies are composed of the modified MESA isolation without parasitic MOS operation, the dual gate SOI-MOSFET's with tied or floating bodies optimized for DRAM specific circuits, the conventional stacked capacitor with increased capacitance by thinner dielectric film, and the other bulk-Si compatible DRAM structure. Moreover, a body bias control technique was applied for body-tied MOSFET's to realize high performance even at low voltage. Integrating the above technologies in the newly designed 0.5-μm 16 MDRAM, high-speed DRAM operation of less than 50 ns has been obtained at low supply voltage of 1 V.
Original language | English |
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Pages (from-to) | 1000-1009 |
Number of pages | 10 |
Journal | IEEE Transactions on Electron Devices |
Volume | 45 |
Issue number | 5 |
DOIs | |
Publication status | Published - 1998 |
Externally published | Yes |
Keywords
- DRAM
- High-speed circuits/devices
- Silicon-oninsulator
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering