Approaches to extra low voltage dram operation by soi-dram

Takahisa Eimori*, Toshiyuki Oashi, Fukashi Morishita, Toshiaki Iwamatsu, Yasuo Yamaguchi, Fumihiro Okuda, Ke N.Ichi Shimomura, Hiroki Shimano, Narumi Sakashita, Kazutami Arimoto, Yasuo Inoue, Shinji Komori, Masahide Inuishi, Tadashi Nishimura, Hirokazu Miyoshi

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)


The newly designed scheme for a low-voltage 16 MDRAM/SOI has been successfully realized and the functional DRAM operation has been obtained at very low supply voltage below 1 V. The key process and circuit technologies for low-voltage/high-speed SOI-DRAM will be described here. The extra low voltage DRAM technologies are composed of the modified MESA isolation without parasitic MOS operation, the dual gate SOI-MOSFET's with tied or floating bodies optimized for DRAM specific circuits, the conventional stacked capacitor with increased capacitance by thinner dielectric film, and the other bulk-Si compatible DRAM structure. Moreover, a body bias control technique was applied for body-tied MOSFET's to realize high performance even at low voltage. Integrating the above technologies in the newly designed 0.5-μm 16 MDRAM, high-speed DRAM operation of less than 50 ns has been obtained at low supply voltage of 1 V.

Original languageEnglish
Pages (from-to)1000-1009
Number of pages10
JournalIEEE Transactions on Electron Devices
Issue number5
Publication statusPublished - 1998
Externally publishedYes


  • DRAM
  • High-speed circuits/devices
  • Silicon-oninsulator

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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