Broadband planar integration and packaging for millimeter-wave circuit design at the V-band

Ki Seok Yang*, Sung Tae Choi, Kiyohito Tokuda, Yong Hoon Kim

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


A broadband planar integration and packaging of millimeter-wave circuits based on the integrated waveguide (IWG) and grounded coplanar waveguide (GCPW) transitions are proposed and demonstrated at the V-band. A novel wideband microstrip-line-to-IWC transition is proposed for the planar integration of the rectangular waveguide devices and the insertion loss per one transition is less than 0.1 dB from 43 to 73 GHz. A proposed surface-mountable filter has an insertion loss of 3 dB and a 3.3% bandwidth at a center frequency of 62 GHz. A broadband ribbon interconnection exhibits law loss of 0.2 dB from DC to 70 GHz and the insertion loss of a single microstrip-to-waveguide transition is less than 0.4 dB from 50 to 75 GHz.

Original languageEnglish
Pages (from-to)371-374
Number of pages4
JournalMicrowave and Optical Technology Letters
Issue number4
Publication statusPublished - 2005 Feb 20
Externally publishedYes


  • Integrated waveguides
  • Interconnections
  • Millimeter-wave integrated circuits
  • Packaging
  • Planar filters

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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