Buttock dummy consisting of force sensors and soft material for the validation of deep tissue injury risk

Kunihiro Ogata, Kohei Kanaya, Tsuyoshi Nakayama, Mitsuo Umezu, Eiichi Ono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wheelchair users, such as individuals with spinal cord injuries and the elderly, have a high risk of pressure ulcer formation due to many hours a day spent sitting. To prevent pressure ulcer formation, its risk needs to be quantified. In cases of deep tissue injury (DTI), it is difficult to predict where tissue breakdown will occur as it is initiated from the tissues under the skin. Therefore, the aim of this study is to develop a human buttock dummy with force sensors and soft material to evaluate the risk of DTI due to the surface of seat. To choose the soft material of the buttock dummy, the elasticity of the human buttock tissue was measured. The proposed buttock dummy consists of rigid simulated pelvis model and simulated soft tissue made from silicone rubber. To evaluate the developed buttock dummy, the pressure force distribution of the buttock dummy was measured and compared with the sitting human, we confirmed that the buttock dummy is similar to the features of the human buttock.

Original languageEnglish
Title of host publicationSII 2017 - 2017 IEEE/SICE International Symposium on System Integration
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages924-929
Number of pages6
ISBN (Electronic)9781538622636
DOIs
Publication statusPublished - 2017 Jul 2
Externally publishedYes
Event2017 IEEE/SICE International Symposium on System Integration, SII 2017 - Taipei, Taiwan, Province of China
Duration: 2017 Dec 112017 Dec 14

Publication series

NameSII 2017 - 2017 IEEE/SICE International Symposium on System Integration
Volume2018-January

Other

Other2017 IEEE/SICE International Symposium on System Integration, SII 2017
Country/TerritoryTaiwan, Province of China
CityTaipei
Period17/12/1117/12/14

ASJC Scopus subject areas

  • Artificial Intelligence
  • Control and Optimization
  • Engineering (miscellaneous)
  • Instrumentation
  • Computer Science Applications
  • Materials Science (miscellaneous)
  • Modelling and Simulation

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