Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Tetsuya Osaka*, Nao Takano, Tetsuya Kurokawa, Tomomi Kaneko, Kazuyoshi Ueno

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

54 Citations (Scopus)


NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.

Original languageEnglish
Pages (from-to)124-127
Number of pages4
JournalSurface and Coatings Technology
Publication statusPublished - 2003 Jun 2


  • Capping layer
  • Electroless deposition
  • Ni-B alloy
  • Thermal stability

ASJC Scopus subject areas

  • General Chemistry
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry


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