Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Jianfeng Yan; Guisheng Zou; Xiaoyu Wang; Fengwen Mu; Hailin Bai; Aiping Wu; Anming Hu; Y. Norman Zhou

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Jianfeng Yan^*, Guisheng Zou, Xiaoyu Wang, Fengwen Mu, Hailin Bai, Aiping Wu, Anming Hu, Y. Norman Zhou

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Tin-lead alloys are widely used as solder in the electronics industry. For concerns of environment and human health, it is necessary to develop new bonding method using Pb-free material for microelectronic packaging. There have been some reports about low temperature bonding using Ag nanoparticles. Compared with Ag nanoparticles, Cu nanoparticles have some advantages, such as low cost and good ionic migration property. In this study we report a low temperature bonding process using Cu nanoparticles. The polymer coated on the surface of Cu nanoparticles can protect them from oxidation. Strong joints were formed at bonding temperatures as low as 180°C under 5MPa in air atmosphere. This novel sintering-bonding technology using Cu nanoparticles as interconnection material has a potential application for electronic packaging.

Original language	English
Title of host publication	Materials Science and Technology Conference and Exhibition 2011, MS and T'11
Pages	1526-1531
Number of pages	6
Publication status	Published - 2011 Dec 1
Externally published	Yes
Event	Materials Science and Technology Conference and Exhibition 2011, MS and T'11 - Columbus, OH, United States Duration: 2011 Oct 16 → 2011 Oct 20

Publication series

Name	Materials Science and Technology Conference and Exhibition 2011, MS and T'11
Volume	2

Conference

Conference	Materials Science and Technology Conference and Exhibition 2011, MS and T'11
Country/Territory	United States
City	Columbus, OH
Period	11/10/16 → 11/10/20

Keywords

Bonding
Cu nanoparticles
Electronic packaging
Sintering

ASJC Scopus subject areas

Materials Science(all)

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Cite this

Yan, J., Zou, G., Wang, X., Mu, F., Bai, H., Wu, A., Hu, A., & Zhou, Y. N. (2011). Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application. In Materials Science and Technology Conference and Exhibition 2011, MS and T'11 (pp. 1526-1531). (Materials Science and Technology Conference and Exhibition 2011, MS and T'11; Vol. 2).

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application. / Yan, Jianfeng; Zou, Guisheng; Wang, Xiaoyu et al.
Materials Science and Technology Conference and Exhibition 2011, MS and T'11. 2011. p. 1526-1531 (Materials Science and Technology Conference and Exhibition 2011, MS and T'11; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yan, J, Zou, G, Wang, X, Mu, F, Bai, H, Wu, A, Hu, A & Zhou, YN 2011, Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application. in Materials Science and Technology Conference and Exhibition 2011, MS and T'11. Materials Science and Technology Conference and Exhibition 2011, MS and T'11, vol. 2, pp. 1526-1531, Materials Science and Technology Conference and Exhibition 2011, MS and T'11, Columbus, OH, United States, 11/10/16.

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title = "Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application",

abstract = "Tin-lead alloys are widely used as solder in the electronics industry. For concerns of environment and human health, it is necessary to develop new bonding method using Pb-free material for microelectronic packaging. There have been some reports about low temperature bonding using Ag nanoparticles. Compared with Ag nanoparticles, Cu nanoparticles have some advantages, such as low cost and good ionic migration property. In this study we report a low temperature bonding process using Cu nanoparticles. The polymer coated on the surface of Cu nanoparticles can protect them from oxidation. Strong joints were formed at bonding temperatures as low as 180°C under 5MPa in air atmosphere. This novel sintering-bonding technology using Cu nanoparticles as interconnection material has a potential application for electronic packaging.",

keywords = "Bonding, Cu nanoparticles, Electronic packaging, Sintering",

author = "Jianfeng Yan and Guisheng Zou and Xiaoyu Wang and Fengwen Mu and Hailin Bai and Aiping Wu and Anming Hu and Zhou, {Y. Norman}",

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T1 - Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

AU - Yan, Jianfeng

AU - Zou, Guisheng

AU - Wang, Xiaoyu

AU - Mu, Fengwen

AU - Bai, Hailin

AU - Wu, Aiping

AU - Hu, Anming

AU - Zhou, Y. Norman

PY - 2011/12/1

Y1 - 2011/12/1

N2 - Tin-lead alloys are widely used as solder in the electronics industry. For concerns of environment and human health, it is necessary to develop new bonding method using Pb-free material for microelectronic packaging. There have been some reports about low temperature bonding using Ag nanoparticles. Compared with Ag nanoparticles, Cu nanoparticles have some advantages, such as low cost and good ionic migration property. In this study we report a low temperature bonding process using Cu nanoparticles. The polymer coated on the surface of Cu nanoparticles can protect them from oxidation. Strong joints were formed at bonding temperatures as low as 180°C under 5MPa in air atmosphere. This novel sintering-bonding technology using Cu nanoparticles as interconnection material has a potential application for electronic packaging.

AB - Tin-lead alloys are widely used as solder in the electronics industry. For concerns of environment and human health, it is necessary to develop new bonding method using Pb-free material for microelectronic packaging. There have been some reports about low temperature bonding using Ag nanoparticles. Compared with Ag nanoparticles, Cu nanoparticles have some advantages, such as low cost and good ionic migration property. In this study we report a low temperature bonding process using Cu nanoparticles. The polymer coated on the surface of Cu nanoparticles can protect them from oxidation. Strong joints were formed at bonding temperatures as low as 180°C under 5MPa in air atmosphere. This novel sintering-bonding technology using Cu nanoparticles as interconnection material has a potential application for electronic packaging.

KW - Bonding

KW - Cu nanoparticles

KW - Electronic packaging

KW - Sintering

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T3 - Materials Science and Technology Conference and Exhibition 2011, MS and T'11

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BT - Materials Science and Technology Conference and Exhibition 2011, MS and T'11

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Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

UN SDGs

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