Compact flip-chip interconnection 112-Gbit/s EADFB laser array module with high eye-mask margin

Shigeru Kanazawa, Takeshi Fujisawa, Nobuhiro Nunoya, Akira Ohki, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Hiroyuki Ishii

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


The first compact and high-performance optical transmitter using flip-chip interconnects has been developed for a 112-Gbit/s transceiver. The flip-chip interconnects provide lower crosstalk and a higher modulation bandwidth than wire interconnects. The flip-chip interconnection module has 3-dB frequency bandwidths of over 30 GHz. This value is up to 5 GHz better than that of a wire interconnection module. Under four-channel simultaneous operation, the OTU4 mask margins for all four lanes of the flip-chip interconnection module exceed 37%. These values are degraded up to only 4% compared with those for single-channel operation. In addition, an error-free transmission through 10 km of single-mode fiber at 112 Gbit/s is demonstrated.

Original languageEnglish
Article number6664988
Pages (from-to)115-121
Number of pages7
JournalJournal of Lightwave Technology
Issue number1
Publication statusPublished - 2014 Jan 1
Externally publishedYes


  • 100 Gbit ethernet
  • Distributed feedback laser
  • EADFB laser array
  • Electro-absorption modulator
  • Flip-chip interconnection
  • In-GaAlAs
  • OTU4
  • Photonic integrated circuits

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics


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