Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

S. Kanazawa; T. Fujisawa; A. Ohki; K. Takahata; H. Sanjoh; R. Iga; H. Ishii

doi:10.1049/el.2013.4276

Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

S. Kanazawa^*, T. Fujisawa, A. Ohki, K. Takahata, H. Sanjoh, R. Iga, H. Ishii

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

14 Citations (Scopus)

Abstract

The first compact electroabsorption modulators integrated with distributed-feedback (EADFB) laser array module using flip-chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip-chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.

Original language	English
Pages (from-to)	533-534
Number of pages	2
Journal	Electronics Letters
Volume	50
Issue number	7
DOIs	https://doi.org/10.1049/el.2013.4276
Publication status	Published - 2014 Mar 27
Externally published	Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.1049/el.2013.4276

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abstract = "The first compact electroabsorption modulators integrated with distributed-feedback (EADFB) laser array module using flip-chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip-chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.",

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AU - Kanazawa, S.

AU - Fujisawa, T.

AU - Ohki, A.

AU - Takahata, K.

AU - Sanjoh, H.

AU - Iga, R.

AU - Ishii, H.

PY - 2014/3/27

Y1 - 2014/3/27

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AB - The first compact electroabsorption modulators integrated with distributed-feedback (EADFB) laser array module using flip-chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip-chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.

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Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

Abstract

ASJC Scopus subject areas

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