Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers

Yuki Masuzaki; Yoshimichi Ohki; Masahiro Kozako

doi:10.1109/ISEIM.2014.6870797

Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers

Yuki Masuzaki, Yoshimichi Ohki, Masahiro Kozako

Kagami Memorial Research Institute for Materials Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

13 Citations (Scopus)

Abstract

Complex permittivity spectra of polydicyclopenta-diene resin and epoxy resin, and their composites with SiO₂ microfiller were obtained in a wide temperature and frequency range. Both ε_r′ and ε_r″ at high temperatures above their glass transition temperatures (T_g's) are much lower in polydicyclopentadiene resin than in epoxy resin, even though the two T_g's are almost the same. Furthermore, analysis using electric modulus has revealed that addition of the microfiller in epoxy resin suppresses dipolar orientation and charge transport. However, both the dipolar orientation and charge transport seem to be difficult in polydicyclopentadien resin and its composite compared to epoxy resin and its composite.

Original language	English
Title of host publication	Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
Publisher	Institute of Electrical Engineers of Japan
Pages	374-377
Number of pages	4
ISBN (Print)	9784886860866
DOIs	https://doi.org/10.1109/ISEIM.2014.6870797
Publication status	Published - 2014
Event	2014 International Symposium on Electrical Insulating Materials, ISEIM 2014 - Niigata, Japan Duration: 2014 Jun 1 → 2014 Jun 5

Publication series

Name	Proceedings of the International Symposium on Electrical Insulating Materials

Other

Other	2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
Country/Territory	Japan
City	Niigata
Period	14/6/1 → 14/6/5

Keywords

complex permittivity
composite
dielectric relaxation
electric modulus
epoxy resin
polydicyclopentadiene resin

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ISEIM.2014.6870797

Cite this

Masuzaki, Y., Ohki, Y., & Kozako, M. (2014). Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. In Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014 (pp. 374-377). Article 6870797 (Proceedings of the International Symposium on Electrical Insulating Materials). Institute of Electrical Engineers of Japan. https://doi.org/10.1109/ISEIM.2014.6870797

Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. / Masuzaki, Yuki; Ohki, Yoshimichi; Kozako, Masahiro.
Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014. Institute of Electrical Engineers of Japan, 2014. p. 374-377 6870797 (Proceedings of the International Symposium on Electrical Insulating Materials).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Masuzaki, Y, Ohki, Y & Kozako, M 2014, Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. in Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014., 6870797, Proceedings of the International Symposium on Electrical Insulating Materials, Institute of Electrical Engineers of Japan, pp. 374-377, 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014, Niigata, Japan, 14/6/1. https://doi.org/10.1109/ISEIM.2014.6870797

Masuzaki Y, Ohki Y, Kozako M. Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. In Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014. Institute of Electrical Engineers of Japan. 2014. p. 374-377. 6870797. (Proceedings of the International Symposium on Electrical Insulating Materials). doi: 10.1109/ISEIM.2014.6870797

Masuzaki, Yuki ; Ohki, Yoshimichi ; Kozako, Masahiro. / Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014. Institute of Electrical Engineers of Japan, 2014. pp. 374-377 (Proceedings of the International Symposium on Electrical Insulating Materials).

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