TY - GEN
T1 - Comparison of Thermal Degradation Between Soft and Hard Epoxy Resins
AU - Ohki, Yoshimichi
AU - Ishii, Hiroyuki
AU - Hirai, Naoshi
N1 - Funding Information:
This research was performed under the research entrusted by Secretariat of Nuclear Regulation Authority in Japan.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Soft epoxy resin with rubber-based additives and ordinary hard epoxy resin, both used as electrical insulators and airtight sealants in electrical penetrations in nuclear power plants (NPPs), were heated in air at various temperatures to simulate their thermal aging. They were then subjected to mechanical and dielectric tests. The soft epoxy resin becomes hard, while its permittivity and loss factor decrease as the heating becomes longer. By these changes, the soft resin tends to exhibit similar behavior in various properties to those of the original unaged hard one. Since its behavior becomes close to the hard one, it can be usable in NPPs. On the other hand, the hard one is hardly affected by the thermal aging.
AB - Soft epoxy resin with rubber-based additives and ordinary hard epoxy resin, both used as electrical insulators and airtight sealants in electrical penetrations in nuclear power plants (NPPs), were heated in air at various temperatures to simulate their thermal aging. They were then subjected to mechanical and dielectric tests. The soft epoxy resin becomes hard, while its permittivity and loss factor decrease as the heating becomes longer. By these changes, the soft resin tends to exhibit similar behavior in various properties to those of the original unaged hard one. Since its behavior becomes close to the hard one, it can be usable in NPPs. On the other hand, the hard one is hardly affected by the thermal aging.
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U2 - 10.1109/ICD53806.2022.9863620
DO - 10.1109/ICD53806.2022.9863620
M3 - Conference contribution
AN - SCOPUS:85138232359
T3 - ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings
SP - 485
EP - 488
BT - ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th IEEE International Conference on Dielectrics, ICD 2022
Y2 - 3 July 2022 through 7 July 2022
ER -