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Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process
Hirokazu Noma*, Takumi Kamibayashi, Hiroyuki Kuwae, Naoya Suzuki, Toshihisa Nonaka, Shuichi Shoji, Jun Mizuno
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
5
Citations
(Scopus)