Contact probe card with large overdrive

Gunsei Kimoto; Takehiro Watanabe; Souta Matsusaka; Takaharu Kuroda; Mikiko Saito

doi:10.1149/1.3557572

Contact probe card with large overdrive

Gunsei Kimoto^*, Takehiro Watanabe, Souta Matsusaka, Takaharu Kuroda, Mikiko Saito

^*Corresponding author for this work

Research Organization for Nano & Life Innovation

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In this paper, we present a new contact probe card with an insulating resin film that can achieve large overdrive. The probe pins were manufactured using Be-Cu through etching and silkscreen polyimide printing. It was confirmed that the probes have a long life expectancy because they act within the thresholds of elastic deformation. The proposed assembly technology allows us to achieve highly accurate probe units with a narrow pitch and a probe thickness of only 28 μm.

Original language	English
Title of host publication	Student Posters (General) - 218th ECS Meeting
Publisher	Electrochemical Society Inc.
Pages	57-67
Number of pages	11
Edition	21
ISBN (Electronic)	9781566778770
ISBN (Print)	9781607682271
DOIs	https://doi.org/10.1149/1.3557572
Publication status	Published - 2010
Event	General Student Poster Session - 218th ECS Meeting - Las Vegas, NV, United States Duration: 2010 Oct 10 → 2010 Oct 15

Publication series

Name	ECS Transactions
Number	21
Volume	33
ISSN (Print)	1938-5862
ISSN (Electronic)	1938-6737

Conference

Conference	General Student Poster Session - 218th ECS Meeting
Country/Territory	United States
City	Las Vegas, NV
Period	10/10/10 → 10/10/15

ASJC Scopus subject areas

Engineering(all)

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1149/1.3557572

Cite this

@inproceedings{b282cd02ba55426aac320d7bd9838176,

title = "Contact probe card with large overdrive",

abstract = "In this paper, we present a new contact probe card with an insulating resin film that can achieve large overdrive. The probe pins were manufactured using Be-Cu through etching and silkscreen polyimide printing. It was confirmed that the probes have a long life expectancy because they act within the thresholds of elastic deformation. The proposed assembly technology allows us to achieve highly accurate probe units with a narrow pitch and a probe thickness of only 28 μm.",

author = "Gunsei Kimoto and Takehiro Watanabe and Souta Matsusaka and Takaharu Kuroda and Mikiko Saito",

year = "2010",

doi = "10.1149/1.3557572",

language = "English",

isbn = "9781607682271",

series = "ECS Transactions",

publisher = "Electrochemical Society Inc.",

number = "21",

pages = "57--67",

booktitle = "Student Posters (General) - 218th ECS Meeting",

edition = "21",

note = "General Student Poster Session - 218th ECS Meeting ; Conference date: 10-10-2010 Through 15-10-2010",

}

TY - GEN

T1 - Contact probe card with large overdrive

AU - Kimoto, Gunsei

AU - Watanabe, Takehiro

AU - Matsusaka, Souta

AU - Kuroda, Takaharu

AU - Saito, Mikiko

PY - 2010

Y1 - 2010

N2 - In this paper, we present a new contact probe card with an insulating resin film that can achieve large overdrive. The probe pins were manufactured using Be-Cu through etching and silkscreen polyimide printing. It was confirmed that the probes have a long life expectancy because they act within the thresholds of elastic deformation. The proposed assembly technology allows us to achieve highly accurate probe units with a narrow pitch and a probe thickness of only 28 μm.

AB - In this paper, we present a new contact probe card with an insulating resin film that can achieve large overdrive. The probe pins were manufactured using Be-Cu through etching and silkscreen polyimide printing. It was confirmed that the probes have a long life expectancy because they act within the thresholds of elastic deformation. The proposed assembly technology allows us to achieve highly accurate probe units with a narrow pitch and a probe thickness of only 28 μm.

UR - http://www.scopus.com/inward/record.url?scp=84863165424&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84863165424&partnerID=8YFLogxK

U2 - 10.1149/1.3557572

DO - 10.1149/1.3557572

M3 - Conference contribution

AN - SCOPUS:84863165424

SN - 9781607682271

T3 - ECS Transactions

SP - 57

EP - 67

BT - Student Posters (General) - 218th ECS Meeting

PB - Electrochemical Society Inc.

T2 - General Student Poster Session - 218th ECS Meeting

Y2 - 10 October 2010 through 15 October 2010

ER -

Contact probe card with large overdrive

Abstract

Publication series

Conference

ASJC Scopus subject areas

UN SDGs

Access to Document

Other files and links

Fingerprint

Cite this