Abstract
Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreased when a small content of nanoclay modified by octadecylamine was added, but the decrease in T g was suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increased when an abundant amount of microsilica was added. At temperatures above T g, both mechanical and dielectric relaxations were accelerated in samples with octadecylamine-modified nanoclay, while the acceleration did not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations were restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss. ©2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(9): 1-9, 2012; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11420
| Original language | English |
|---|---|
| Pages (from-to) | 1-9 |
| Number of pages | 9 |
| Journal | Electronics and Communications in Japan |
| Volume | 95 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - 2012 Sept |
Keywords
- dielectric properties
- epoxy resin
- filler modifier.
- mechanical properties
- microcomposite
- polymer nanocomposite
ASJC Scopus subject areas
- Signal Processing
- Physics and Astronomy(all)
- Computer Networks and Communications
- Electrical and Electronic Engineering
- Applied Mathematics