TY - JOUR
T1 - Correlation between mechanical and dielectric relaxation processes in epoxy resin composites with nano-and micro-fillers
AU - Hyuga, Mayumi
AU - Tanaka, Toshikatsu
AU - Ohki, Yoshimichi
AU - Imai, Takahiro
AU - Harada, Miyuki
AU - Ochi, Mitsukazu
PY - 2011
Y1 - 2011
N2 - Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreases when a small content of nanoclay modified by octadecylamine was added, while the decrease in T g is suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increases when microsilica was added abundantly. At temperatures above T g, both mechanical and dielectric relaxations are accelerated in samples with octadecylamine-modified nanoclay, while the acceleration does not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations are restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss.
AB - Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreases when a small content of nanoclay modified by octadecylamine was added, while the decrease in T g is suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increases when microsilica was added abundantly. At temperatures above T g, both mechanical and dielectric relaxations are accelerated in samples with octadecylamine-modified nanoclay, while the acceleration does not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations are restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss.
KW - Dielectric properties
KW - Epoxy resin
KW - Filler modifier
KW - Mechanical properties
KW - Microcomposite
KW - Polymer nanocomposite
UR - http://www.scopus.com/inward/record.url?scp=84862912560&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84862912560&partnerID=8YFLogxK
U2 - 10.1541/ieejfms.131.1041
DO - 10.1541/ieejfms.131.1041
M3 - Article
AN - SCOPUS:84862912560
SN - 0385-4205
VL - 131
SP - 1041
EP - 1047
JO - IEEJ Transactions on Fundamentals and Materials
JF - IEEJ Transactions on Fundamentals and Materials
IS - 12
ER -