Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution

Ken'ichi Yokoyama; Akihide Nogami; Jun'ichi Sakai

doi:10.1016/j.corsci.2014.05.004

Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution

Ken'ichi Yokoyama^*, Akihide Nogami, Jun'ichi Sakai

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

The surface crack nucleation of Sn-3.0Ag and Sn-0.5Cu solder alloys has been examined by performing sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For Sn-3.0Ag alloy, many cracks nucleate and propagate on the side surface of the specimen, similarly to Sn-3.0Ag-0.5Cu alloy reported previously. For Sn-0.5Cu alloy, such cracks are not observed, and ordinary creep deformation occurs in the solution. The effect of sustained applied stress, i.e., creep, on the dissolution of ions is smaller for Sn-0.5Cu alloy than for Sn-3.0Ag alloy. The present results suggest that there are differences in the susceptibility to cracking under applied stress in a solution, i.e., creep corrosion cracking, among lead-free solder alloys.

Original language	English
Pages (from-to)	142-148
Number of pages	7
Journal	Corrosion Science
Volume	86
DOIs	https://doi.org/10.1016/j.corsci.2014.05.004
Publication status	Published - 2014

Keywords

A. Electronic materials
A. Tin
B. SEM
C. Intergranular corrosion
C. Stress corrosion

ASJC Scopus subject areas

Materials Science(all)
Chemical Engineering(all)
Chemistry(all)

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10.1016/j.corsci.2014.05.004

Cite this

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title = "Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution",

abstract = "The surface crack nucleation of Sn-3.0Ag and Sn-0.5Cu solder alloys has been examined by performing sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For Sn-3.0Ag alloy, many cracks nucleate and propagate on the side surface of the specimen, similarly to Sn-3.0Ag-0.5Cu alloy reported previously. For Sn-0.5Cu alloy, such cracks are not observed, and ordinary creep deformation occurs in the solution. The effect of sustained applied stress, i.e., creep, on the dissolution of ions is smaller for Sn-0.5Cu alloy than for Sn-3.0Ag alloy. The present results suggest that there are differences in the susceptibility to cracking under applied stress in a solution, i.e., creep corrosion cracking, among lead-free solder alloys.",

keywords = "A. Electronic materials, A. Tin, B. SEM, C. Intergranular corrosion, C. Stress corrosion",

author = "Ken'ichi Yokoyama and Akihide Nogami and Jun'ichi Sakai",

year = "2014",

doi = "10.1016/j.corsci.2014.05.004",

language = "English",

volume = "86",

pages = "142--148",

journal = "Corrosion Science",

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publisher = "Elsevier Limited",

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TY - JOUR

T1 - Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution

AU - Yokoyama, Ken'ichi

AU - Nogami, Akihide

AU - Sakai, Jun'ichi

PY - 2014

Y1 - 2014

N2 - The surface crack nucleation of Sn-3.0Ag and Sn-0.5Cu solder alloys has been examined by performing sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For Sn-3.0Ag alloy, many cracks nucleate and propagate on the side surface of the specimen, similarly to Sn-3.0Ag-0.5Cu alloy reported previously. For Sn-0.5Cu alloy, such cracks are not observed, and ordinary creep deformation occurs in the solution. The effect of sustained applied stress, i.e., creep, on the dissolution of ions is smaller for Sn-0.5Cu alloy than for Sn-3.0Ag alloy. The present results suggest that there are differences in the susceptibility to cracking under applied stress in a solution, i.e., creep corrosion cracking, among lead-free solder alloys.

AB - The surface crack nucleation of Sn-3.0Ag and Sn-0.5Cu solder alloys has been examined by performing sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For Sn-3.0Ag alloy, many cracks nucleate and propagate on the side surface of the specimen, similarly to Sn-3.0Ag-0.5Cu alloy reported previously. For Sn-0.5Cu alloy, such cracks are not observed, and ordinary creep deformation occurs in the solution. The effect of sustained applied stress, i.e., creep, on the dissolution of ions is smaller for Sn-0.5Cu alloy than for Sn-3.0Ag alloy. The present results suggest that there are differences in the susceptibility to cracking under applied stress in a solution, i.e., creep corrosion cracking, among lead-free solder alloys.

KW - A. Electronic materials

KW - A. Tin

KW - B. SEM

KW - C. Intergranular corrosion

KW - C. Stress corrosion

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U2 - 10.1016/j.corsci.2014.05.004

DO - 10.1016/j.corsci.2014.05.004

M3 - Article

AN - SCOPUS:84903438097

SN - 0010-938X

VL - 86

SP - 142

EP - 148

JO - Corrosion Science

JF - Corrosion Science

ER -

Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution

Abstract

Keywords

ASJC Scopus subject areas

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