Current Behavior Simulation in Stacked NI REBCO Pancake Coils during Local Normal-State Transition

So Noguchi*, Ryosuke Miyao, Katsutoshi Monma, Hajime Igarashi, Hiroshi Ueda, Atsushi Ishiyama

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)

Abstract

This paper presents the current behavior and axial Lorenz force of stacked no-insulation (NI) REBa2Cu3O7-x (REBCO, RE = Rare Earth) double-pancake coils during local normal-state transition. The NI winding technique enhances the thermal stability and increases the engineering current density in REBCO pancake coils. The high thermal stability of NI REBCO coil has been verified in experiments of overcurrent test. In addition, the numerical simulations of NI REBCO single-pancake coils have been performed to confirm the high stability. However, REBCO magnets usually consist of some stacked double-pancake coils to generate a high magnetic field for practical applications. When a normal-state transition occurs in one of the stacked pancake coils, it may affect the other pancake coils. For the more reliable verification, the current and electromagnetic force behavior of stacked NI REBCO pancake coils during a normal-state transition should be simulated. To examine the stacked NI REBCO pancake coils, we extend the previously proposed partial element equivalent circuit (PEEC) model to deal with a few double-pancake coils. In this paper, an NI REBCO double-pancake coil and their three stacked coils are simulated by using the extended PEEC model.

Original languageEnglish
Article number7828084
JournalIEEE Transactions on Applied Superconductivity
Volume27
Issue number4
DOIs
Publication statusPublished - 2017 Jun

Keywords

  • Electromagnetic force
  • no-insulation (NI) REBCO pancake coil
  • partial element equivalent circuit (PEEC) model
  • quench protection
  • thermal stability

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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