Current-voltage characteristics of p-InGaNn-GaN vertical conducting diodes on n+ -SiC substrates

Atsushi Nishikawa*, Kazuhide Kumakura, Tetsuya Akasaka, Toshiki Makimoto

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)


p-InGaNn-GaN vertical conducting diodes have been grown on n+ -SiC substrates by low-pressure metalorganic vapor phase epitaxy and their current-voltage characteristics have been investigated. The typical forward voltage drop was 3.8-4.0 V at a forward current density of 100 A cm2 with an on-state resistance of ∼1.3 mω cm2. The ideality factor of the samples was ∼2, meaning that the tunneling current through defects is small enough in these devices. The breakdown voltage (VB) increased with increasing n-GaN layer thickness, while it increased with decreasing carrier concentration of the layer by substituting undoped GaN for n-GaN. When the undoped GaN layer thickness was increased to 1800 nm, the highest breakdown voltage of 305 V was obtained with a low on-state resistance (Ron) of 1.51 mω cm2, leading to the figure-of-merit, (VB) 2 Ron, of 62 MW cm2.

Original languageEnglish
Article number233505
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Issue number23
Publication statusPublished - 2005
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)


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