Deep submicron field isolation with buried insulator between polysilicon electrodes (BIPS)

Masahiro Shimizu*, Masahide Inuishi, Katsuhiro Tsukamoto, Hideaki Arima, Hirokazu Miyoshi

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


A novel isolation structure which has a buried insulator between polysilicon electrodes (BIPS) has been developed. The BIPS isolation employs the refilling CVD-oxides in openings between polysilicon electrodes by photoresist etchback process. Device characteristics and parasitic effects of BIPS isolation have been compared with that of LOCOS isolation. Using BIPS isolation, we can almost suppress the narrow-channel effects and achieve the deep submicron isolation. No degradation on the subthreshold decay of devices with BIPS isolation can be obtained. The use of BIPS isolation technology yields a DRAM cell of small area. The successful fabrication of deep submicron devices with BIPS isolation clearly demonstrates that this technology has superior ability to overcome the LOCOS isolation.

Original languageEnglish
Pages (from-to)1369-1375
Number of pages7
JournalIEICE Transactions on Electronics
Issue number8
Publication statusPublished - 1994 Aug 1
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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