Denser and taller carbon nanotube arrays on Cu foils useable as thermal interface materials

Nuri Na, Kei Hasegawa, Xiaosong Zhou, Mizuhisa Nihei, Suguru Noda*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)


To achieve denser and taller carbon nanotube (CNT) arrays on Cu foils, catalyst and chemical vapor deposition (CVD) conditions were carefully engineered. CNTs were grown to ∼50μm using Fe/TiN/Ta catalysts in which Ta and TiN acted as diffusion barriers for Cu and Ta, respectively. A tradeoff was found between the mass density and height of the CNTarrays, and CNTarrays with a mass density of 0.30 g cm-3 and height of 45μm were achieved under optimized conditions. Thermal interface materials (TIMs) with CNT array/Cu foil/CNT array structures showed decreasing thermal resistance from 86 to 24mm2KW-1 with increasing CNT array mass densities from 0.07-0.08 to 0.19-0.26 g cm-3 for Cu and Al blocks with surfaces as rough as 20-30 μm. The best CNT/Cu/CNT TIMs showed thermal resistance values comparable to that of a typical indium sheet TIM.

Original languageEnglish
Article number095102
JournalJapanese journal of applied physics
Issue number9
Publication statusPublished - 2015 Sept 1

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)


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