Deposition behavior of Ni on Si(100) surfaces in an aqueous alkaline solution

Daisuke Niwa*, Takayuki Homma, Tetsuya Osaka

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


The spontaneous deposition of Ni on Si(100) surface in aqueous alkaline solution was investigated under various conditions. In a 0.1 M NiSO4 solution containing 0.2-0.5 M (NH4)2SO4, the optimum pH for the homogeneous deposition at 60-80°C at each set of operating conditions shifted in the high-pH direction as both (NH 4)2SO4 concentration and the operating temperature were decreased. The potential at which the deposition terminates and the deposition duration were determined from electrochemical open-circuit potential profiles. The different behaviors, observed at different pH levels, are discussed in terms of these potential measurements. Ultraviolet-visible absorption spectra of various Ni solutions used indicated that the deposition behavior was strongly affected by the composition of the Ni complex and the reactivity of Si surface. The deposition reaction efficiently proceeded when the Ni complex was present in a specific composition. The anodic reaction rate of Si decreased steeply when the solution temperature was lowered. The optimum condition for the homogeneous deposition was greatly affected by the reactivity of the Si surface rather man the composition of the complex, the higher pH favoring the overall reaction.

Original languageEnglish
Pages (from-to)C54-C59
JournalJournal of the Electrochemical Society
Issue number2
Publication statusPublished - 2005 Mar 17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry


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