TY - JOUR
T1 - Deposition mechanism of a-Si
T2 - H films fabricated by coaxial-line-type microwave plasma chemical vapour deposition
AU - Kato, Isamu
AU - Hatanaka, Kazuhisa
AU - Tatsumi, Tetsuya
PY - 1989
Y1 - 1989
N2 - Hydrogenated amorphous silicon (a-Si:H) films are fabricated outside of hydrogen or argon plasma by using a double-tubed, coaxial-line-type, microwave plasma chemical vapor deposition (CVD) system. Thermal stability of the films is investigated by annealing. A deposition mechanism and a hydrogen evolution mechanism are proposed. By using hydrogen discharge, good quality, thermally stable films are obtained even at room temperature. In this case, silane radicals have large surface mobility due to the covering effect of hydrogen atoms and the soft-landing of silane radicals on the film's surface. The large surface mobility allows the silane radicals to move and to from bands with dangling bonds having a low potential energy and hence contributes to atructural stabilization.
AB - Hydrogenated amorphous silicon (a-Si:H) films are fabricated outside of hydrogen or argon plasma by using a double-tubed, coaxial-line-type, microwave plasma chemical vapor deposition (CVD) system. Thermal stability of the films is investigated by annealing. A deposition mechanism and a hydrogen evolution mechanism are proposed. By using hydrogen discharge, good quality, thermally stable films are obtained even at room temperature. In this case, silane radicals have large surface mobility due to the covering effect of hydrogen atoms and the soft-landing of silane radicals on the film's surface. The large surface mobility allows the silane radicals to move and to from bands with dangling bonds having a low potential energy and hence contributes to atructural stabilization.
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M3 - Article
AN - SCOPUS:0024931543
SN - 0372-7181
SP - 1
EP - 12
JO - Waseda Daigaku Rikogaku Kenkyusho Hokoku/Bulletin of Science and Engineering Research Laboratory, Waseda University
JF - Waseda Daigaku Rikogaku Kenkyusho Hokoku/Bulletin of Science and Engineering Research Laboratory, Waseda University
IS - 123
ER -