TY - GEN
T1 - Deposition techniques of c-axis-tilted ScAlN films by conventional RF magnetron sputtering
AU - Arakawa, Kazuki
AU - Yanagitani, Takahiko
AU - Kano, Kazuhiko
AU - Teshigahara, Akihiko
AU - Akiyama, Morito
PY - 2010
Y1 - 2010
N2 - It is difficult to synthesize c-axis tilted ScAlN films by using co-sputtering because unidirectional oblique incident of sputtered particles is needed to obtain c-axis tilted structure. To realize the oblique incident single source sputtering technique was proposed for c-axis tilted film deposition. ScAl alloy target was used to achieve ScAlN film synthesis instead of co-sputtering. As a result c-axis highly tilted ScAlN film (tilt angle 33) was obtained by using this deposition technique. From the result of film transducer loss measurement we found that longitudinal and shear elasticity of AlN decreases by adding Sc. c-axis highly tilted ScAlN film showed giant k 15' values of 0.32 in spite of its low degree of orientation.
AB - It is difficult to synthesize c-axis tilted ScAlN films by using co-sputtering because unidirectional oblique incident of sputtered particles is needed to obtain c-axis tilted structure. To realize the oblique incident single source sputtering technique was proposed for c-axis tilted film deposition. ScAl alloy target was used to achieve ScAlN film synthesis instead of co-sputtering. As a result c-axis highly tilted ScAlN film (tilt angle 33) was obtained by using this deposition technique. From the result of film transducer loss measurement we found that longitudinal and shear elasticity of AlN decreases by adding Sc. c-axis highly tilted ScAlN film showed giant k 15' values of 0.32 in spite of its low degree of orientation.
KW - RF magnetron sputtering
KW - ScAl alloy target
KW - ScAlN films
KW - c axis tilted films
UR - http://www.scopus.com/inward/record.url?scp=80054764501&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=80054764501&partnerID=8YFLogxK
U2 - 10.1109/ULTSYM.2010.5935747
DO - 10.1109/ULTSYM.2010.5935747
M3 - Conference contribution
AN - SCOPUS:80054764501
SN - 9781457703829
T3 - Proceedings - IEEE Ultrasonics Symposium
SP - 1050
EP - 1053
BT - 2010 IEEE International Ultrasonics Symposium, IUS 2010
T2 - 2010 IEEE International Ultrasonics Symposium, IUS 2010
Y2 - 11 October 2010 through 14 October 2010
ER -