TY - GEN
T1 - Detection of electrochemical migration growth along the thickness direction in a paper/phenol-resin composite
AU - Asakawa, Hiroki
AU - Natsui, Masashi
AU - Ohki, Yoshimichi
AU - Tanaka, Toshikatsu
AU - Maeno, Takashi
AU - Okamoto, Kenji
PY - 2010/10/25
Y1 - 2010/10/25
N2 - In order to study the growth of electrochemical migration along the thickness direction, paper/phenol-resin composite on printed wiring boards was aged at 85 °C and 85%RH by applying of a dc voltage. Then, the sample was observed by a scanning electron microscope with a function of energy dispersive spectroscopy (SEM-EDS) analysis. Space charge distributions in the sample were also measured by the pulsed electroacoustic method. Signals of SEM-EDS showing the presence of Cu were observed on both the anode and cathode. This fact indicates that ionized copper moves toward the cathode inside the composite when an electric field is applied at high temperatures in a highly humid atmosphere.
AB - In order to study the growth of electrochemical migration along the thickness direction, paper/phenol-resin composite on printed wiring boards was aged at 85 °C and 85%RH by applying of a dc voltage. Then, the sample was observed by a scanning electron microscope with a function of energy dispersive spectroscopy (SEM-EDS) analysis. Space charge distributions in the sample were also measured by the pulsed electroacoustic method. Signals of SEM-EDS showing the presence of Cu were observed on both the anode and cathode. This fact indicates that ionized copper moves toward the cathode inside the composite when an electric field is applied at high temperatures in a highly humid atmosphere.
KW - Electrochemical migration
KW - Paper/phenol-resin composite
KW - Printed wiring board
KW - Pulsed electroacoustic method
KW - SEM-EDS
KW - Space charge
UR - http://www.scopus.com/inward/record.url?scp=77958064639&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77958064639&partnerID=8YFLogxK
U2 - 10.1109/ICSD.2010.5568010
DO - 10.1109/ICSD.2010.5568010
M3 - Conference contribution
AN - SCOPUS:77958064639
SN - 9781424479443
T3 - Proceedings of the 2010 IEEE International Conference on Solid Dielectrics, ICSD 2010
BT - Proceedings of the 2010 IEEE International Conference on Solid Dielectrics, ICSD 2010
T2 - 2010 IEEE International Conference on Solid Dielectrics, ICSD 2010
Y2 - 4 July 2010 through 9 July 2010
ER -