Abstract
Pulsed electroacoustic (PEA) method is applied as a nondestructive technique to detect ion migration that progresses to the thickness direction in insulation composites for printed circuit boards. In both cases of a paper/phenol-resin composite and a glass/epoxy-resin composite, penetration of Cu migration into the bulk after aging was confirmed. Namely, a shift of the peak location of positive charge, which corresponds to the progress of migration in the aged composite, is observable by the PEA method.
Original language | English |
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Pages | 376-379 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 2008 Dec 31 |
Event | 2008 International Symposium on Electrical Insulating Materials, ISEIM 2008 - Yokkaichi, Japan Duration: 2008 Sept 7 → 2008 Sept 11 |
Conference
Conference | 2008 International Symposium on Electrical Insulating Materials, ISEIM 2008 |
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Country/Territory | Japan |
City | Yokkaichi |
Period | 08/9/7 → 08/9/11 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials