Developing an application for 3D IC chip stacking technology: How to shift from fundamental to practical technology

Masahiro Aoyagi; Fumito Imura; Fumiki Kato; Katsuya Kikuchi; Naoya Watanabe; Motohiro Suzuki; Hiroshi Nakagawa; Yoshikuni Okada; Tokihiko Yokoshima; Yasuhiro Yamaji; Shunsuke Nemoto; Bui Thanh Tung; Melamed Samson

doi:10.5571/synth.9.1_1

Developing an application for 3D IC chip stacking technology: How to shift from fundamental to practical technology

Masahiro Aoyagi^*, Fumito Imura, Fumiki Kato, Katsuya Kikuchi, Naoya Watanabe, Motohiro Suzuki, Hiroshi Nakagawa, Yoshikuni Okada, Tokihiko Yokoshima, Yasuhiro Yamaji, Shunsuke Nemoto, Bui Thanh Tung, Melamed Samson

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

3D IC chip stacking technology is expected to be the future of electronic device integration technology, because integration along the additional dimension affords efficient use of space and improvement of system architecture. We developed fundamental technology of high density integration for 3D IC chip stacking. To facilitate applications of this technology, a mass-production process was developed in collaboration with a production system company.

Original language	English
Pages (from-to)	1-14
Number of pages	14
Journal	Synthesiology
Volume	9
Issue number	1
DOIs	https://doi.org/10.5571/synth.9.1_1
Publication status	Published - 2016 Mar 19
Externally published	Yes

Keywords

3D stacking
IC
Packaging
Semiconductor device
TSV

ASJC Scopus subject areas

Engineering(all)
Social Sciences(all)

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10.5571/synth.9.1_1

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AU - Aoyagi, Masahiro

AU - Imura, Fumito

AU - Kato, Fumiki

AU - Kikuchi, Katsuya

AU - Watanabe, Naoya

AU - Suzuki, Motohiro

AU - Nakagawa, Hiroshi

AU - Okada, Yoshikuni

AU - Yokoshima, Tokihiko

AU - Yamaji, Yasuhiro

AU - Nemoto, Shunsuke

AU - Tung, Bui Thanh

AU - Samson, Melamed

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AB - 3D IC chip stacking technology is expected to be the future of electronic device integration technology, because integration along the additional dimension affords efficient use of space and improvement of system architecture. We developed fundamental technology of high density integration for 3D IC chip stacking. To facilitate applications of this technology, a mass-production process was developed in collaboration with a production system company.

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KW - Packaging

KW - Semiconductor device

KW - TSV

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Developing an application for 3D IC chip stacking technology: How to shift from fundamental to practical technology

Abstract

Keywords

ASJC Scopus subject areas

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