TY - GEN
T1 - Development of a Novel Biomaterial for Spinal Implant Purpose
AU - Kishimoto, Kazuma
AU - Shoji, Shuichi
AU - Mizuno, Jun
N1 - Funding Information:
This research was supported by Japan Ministry of Education, Culture, Sports Science & Technology (MEXT) and MEXT Nanotechnology Platform Support Project of Waseda University. We would like to express our sincere gratitude to Dr. Kazuhito Morioka (University of California, San Francisco) and Dr. Chikara Ushiku (The Jikei University Hospital) for their valuable insight and constructive suggestions throughout this research work.
Publisher Copyright:
© 2022 Japan Institute of Electronics Packaging.
PY - 2022
Y1 - 2022
N2 - In this study, we have successfully fabricated a novel biomaterial polymer, possessing a 3D microarchitecture, with a simple and inexpensive manufacturing process. This biomaterial is a polydimethylsiloxane (PDMS) and poly(ether) ether ketone (PEEK) composites, which possesses highly porous structure, mimicking the mechanical and heterogeneous properties of the human body. For biocompatible approaches, a thin film of TiO2 was deposited on the surface of the polymer using atomic layer deposition (ALD). Based on scanning electron microscopy analysis, universal tensile testing and x-ray photoelectron spectroscopy analysis, it was confirmed that this novel biomaterial has a high potential of becoming a spinal implant material in the future.
AB - In this study, we have successfully fabricated a novel biomaterial polymer, possessing a 3D microarchitecture, with a simple and inexpensive manufacturing process. This biomaterial is a polydimethylsiloxane (PDMS) and poly(ether) ether ketone (PEEK) composites, which possesses highly porous structure, mimicking the mechanical and heterogeneous properties of the human body. For biocompatible approaches, a thin film of TiO2 was deposited on the surface of the polymer using atomic layer deposition (ALD). Based on scanning electron microscopy analysis, universal tensile testing and x-ray photoelectron spectroscopy analysis, it was confirmed that this novel biomaterial has a high potential of becoming a spinal implant material in the future.
KW - ALD
KW - PDMS
KW - PEEK
KW - TiO
KW - biomaterial
KW - porous
UR - http://www.scopus.com/inward/record.url?scp=85133366816&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85133366816&partnerID=8YFLogxK
U2 - 10.23919/ICEP55381.2022.9795614
DO - 10.23919/ICEP55381.2022.9795614
M3 - Conference contribution
AN - SCOPUS:85133366816
T3 - 2022 International Conference on Electronics Packaging, ICEP 2022
SP - 85
EP - 86
BT - 2022 International Conference on Electronics Packaging, ICEP 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronics Packaging, ICEP 2022
Y2 - 11 May 2022 through 14 May 2022
ER -