Abstract
Wire bonding technology that can produce more compact and higher density chips without modifying the existing assembly process is desired. This paper discusses reduction of the diameter of ball to be performed at the tip of the wire, the required wire diameter reduction, capillary tip diameter reduction, and attainment of a higher Young's modulus for the wire that can suppress wire sweep in transfer molding. It also indicates that wire bonding for a pitch of 70μm or less can be performed with no problem in reliability of the bonded zone.
| Original language | English |
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| Pages | 295-298 |
| Number of pages | 4 |
| Publication status | Published - 1995 Dec 1 |
| Externally published | Yes |
| Event | Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA Duration: 1995 Oct 2 → 1995 Oct 4 |
Other
| Other | Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium |
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| City | Austin, TX, USA |
| Period | 95/10/2 → 95/10/4 |
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering