Dielectric breakdown due to hole avalanche in plasma polymer films

K. Ishii*, Y. Ohki, T. Nakano

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

High-field conduction and dielectric breakdown characteristics of plasma-polymerized films of ethylene and trifluoromethane (PPEF) and those of ethylene (PPE) were studied. Based on experimental results on the prebreakdown current, time lag to breakdown, and thickness or electrode metal dependence on dielectric strength, it is shown that the breakdown is caused by hole avalanche and that scattering of holes by fluorine atoms results in higher dielectric strength in PPEF than in PPE.

Original languageEnglish
Pages (from-to)76-79
Number of pages4
JournalConference Record of IEEE International Symposium on Electrical Insulation
Publication statusPublished - 1990 Dec 1
EventConference Record of the 1990 IEEE International Symposium on Electrical Insulation - Toronto, Ca
Duration: 1990 Jun 31990 Jun 6

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Building and Construction

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