TY - GEN
T1 - Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces
AU - Tanaka, T.
AU - Iizuka, T.
AU - Ohki, Y.
AU - Huang, X.
AU - Jiang, P.
PY - 2013/12/1
Y1 - 2013/12/1
N2 - Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.
AB - Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.
KW - coupling agents
KW - high thermal conductivity
KW - interfaces
KW - multifunctional materials
KW - polymer composites
UR - http://www.scopus.com/inward/record.url?scp=84891605304&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84891605304&partnerID=8YFLogxK
U2 - 10.1109/ICSD.2013.6619742
DO - 10.1109/ICSD.2013.6619742
M3 - Conference contribution
AN - SCOPUS:84891605304
SN - 9781479908073
T3 - Proceedings of IEEE International Conference on Solid Dielectrics, ICSD
SP - 377
EP - 380
BT - ICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics
T2 - ICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics
Y2 - 30 June 2013 through 4 July 2013
ER -