Effect of carbon content on the electrical resistivity of electrodeposited copper

Tetsuya Osaka*, Noriyuki Yamachika, Masahiro Yoshino, Madoka Hasegawa, Yoshinori Negishi, Yutaka Okinaka

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Citations (Scopus)


Copper films electrodeposited from acid sulfate baths containing conventional additives used in the damascene process for the fabrication of ultralarge-scale integration interconnects were analyzed quantitatively to investigate the relation between carbon content and electrical resistivity of the deposit. In the as-deposited state, the resistivity of deposits that did not exhibit self-annealing effects in scanning ion microscope examination increased almost linearly with carbon content in the range of 0.002-0.045 wt %. The deposits that exhibited self-annealing effects showed higher resistivity values at identical carbon contents. After self-annealing, resistivity values of all deposits varied almost linearly with carbon content.

Original languageEnglish
Pages (from-to)D15-D17
JournalElectrochemical and Solid-State Letters
Issue number3
Publication statusPublished - 2009 Jan 19

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering


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