Effect of Cu on the structure and magnetic properties of FePt sputtered film

Y. K. Takahashi, M. Ohnuma, K. Hono*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


We have investigated the effect of Cu addition to the FePt alloy on the ordering kinetics and the coercivities of sputter deposited thin films. By alloying 4at% Cu, the temperature that A1 phase orders to the L10 structure decrease from 500°C to 400°C. The lattice parameters of the L10-ordered phase suggest that Fe atoms are substituted by Cu. The grain size increases by the addition of Cu, suggesting that the decrease of the annealing temperature for ordering is due to the enhanced kinetics of ordering as a result of higher diffusivity obtained from the alloy with the lower melting temperature.

Original languageEnglish
Pages (from-to)259-265
Number of pages7
JournalJournal of Magnetism and Magnetic Materials
Issue number1-2
Publication statusPublished - 2002 Apr
Externally publishedYes


  • Coercivity
  • Microstructure
  • Ordering
  • Sputtering
  • Thin film

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics


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