Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa; K. Matsunaga; M. S. Kim; M. Saito; J. Mizuno

doi:10.4071/2016-hitec-143

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa, K. Matsunaga, M. S. Kim, M. Saito, J. Mizuno

Research Organization for Nano & Life Innovation

Research output: Contribution to conference › Paper › peer-review

Abstract

High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

Original language	English
DOIs	https://doi.org/10.4071/2016-hitec-143
Publication status	Published - 2016
Event	IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 - Albuquerque, United States Duration: 2016 May 10 → 2016 May 12

Conference

Conference	IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
Country/Territory	United States
City	Albuquerque
Period	16/5/10 → 16/5/12

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.4071/2016-hitec-143

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Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach. / Nishikawa, H.; Matsunaga, K.; Kim, M. S. et al.
2016. Paper presented at IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, United States.

Research output: Contribution to conference › Paper › peer-review

Nishikawa, H, Matsunaga, K, Kim, MS, Saito, M & Mizuno, J 2016, 'Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach', Paper presented at IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, United States, 16/5/10 - 16/5/12. https://doi.org/10.4071/2016-hitec-143

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AU - Saito, M.

AU - Mizuno, J.

PY - 2016

Y1 - 2016

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AB - High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

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Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

Abstract

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ASJC Scopus subject areas

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