TY - GEN
T1 - Effect of Yttrium Iron Garnet Thick Film in Fabrication of Flexible Microstrip Patch Antenna
AU - Hasan, Intan Helina
AU - Hamidon, Mohd Nizar
AU - Ismail, Alyani
AU - Ismail, Ismayadi
AU - Azhari, Nur Alin Mohd
AU - Azhari, Saman
AU - Kusaimi, Muhammad Asnawi Mohd
AU - Osman, Rosiah
N1 - Funding Information:
and staffs of Institute of Advanced Technology for their support in this work. This work is supported by Ministry of Science, Technology and Innovation (MOSTI) Sciencefund 03-04-01-SF1360 and Ministry of Higher Education (MOHE) LRGS NanoMITe fund LRGS/2015/UKM-UPM/NanoMITe/04/02.
Funding Information:
The authors gratefully acknowledge the contributions students from Electron Devices Group, and staffs of Institute of Advanced Technology for their support in this work. This work is supported by Ministry of Science, Technology and Innovation (MOSTI) Sciencefund 03-04-01-SF1360 and Ministry of Higher Education (MOHE) LRGS NanoMITe fund LRGS/2015/UKM-UPM/NanoMITe/04/02.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/3
Y1 - 2019/3
N2 - In this work, yttrium iron garnet (YIG) thick film paste was printed onto Kapton polyimide film to form a substrate overlay, which then a silver patch was printed onto it to form a flexible microstrip patch antenna (MPA). Measurement results showed that the flexible MPA with YIG thick film inclusion showed improved return loss, as well as having good stability when the MPA is being bent.
AB - In this work, yttrium iron garnet (YIG) thick film paste was printed onto Kapton polyimide film to form a substrate overlay, which then a silver patch was printed onto it to form a flexible microstrip patch antenna (MPA). Measurement results showed that the flexible MPA with YIG thick film inclusion showed improved return loss, as well as having good stability when the MPA is being bent.
KW - ferrites
KW - flexible antenna
KW - thick film
KW - yttrium iron garnet
UR - http://www.scopus.com/inward/record.url?scp=85067786498&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85067786498&partnerID=8YFLogxK
U2 - 10.1109/EDTM.2019.8731293
DO - 10.1109/EDTM.2019.8731293
M3 - Conference contribution
AN - SCOPUS:85067786498
T3 - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
SP - 389
EP - 391
BT - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
Y2 - 12 March 2019 through 15 March 2019
ER -