Effects of impurities on resistivity of electrodeposited high-Bs CoNiFe-based soft magnetic thin films

Tetsuya Osaka; Tokihiko Yokoshima; Takuya Nakanishi

doi:10.1109/20.950960

Effects of impurities on resistivity of electrodeposited high-B_s CoNiFe-based soft magnetic thin films

Tetsuya Osaka^*, Tokihiko Yokoshima, Takuya Nakanishi

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

15 Citations (Scopus)

Abstract

Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-B_s CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

Original language	English
Pages (from-to)	1761-1763
Number of pages	3
Journal	IEEE Transactions on Magnetics
Volume	37
Issue number	4 I
DOIs	https://doi.org/10.1109/20.950960
Publication status	Published - 2001 Jul
Event	8th Joint Magnetism and Magnetic Materials -International Magnetic Conference- (MMM-Intermag) - San Antonio, TX, United States Duration: 2001 Jan 7 → 2001 Jan 11

Keywords

Electrodeposition
Impurities
Organic additives
Resistivity
Soft magnetic thin films

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/20.950960

Cite this

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title = "Effects of impurities on resistivity of electrodeposited high-Bs CoNiFe-based soft magnetic thin films",

abstract = "Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-Bs CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.",

keywords = "Electrodeposition, Impurities, Organic additives, Resistivity, Soft magnetic thin films",

author = "Tetsuya Osaka and Tokihiko Yokoshima and Takuya Nakanishi",

note = "Funding Information: This work was supported by the Research for the Future Project “Advanced Research and Development on High Density Magnetic Recording Devices by means of Atomic Interface Design” of the Japan Society for the Promotion of Science and by the Storage Research Consortium (SRC).; 8th Joint Magnetism and Magnetic Materials -International Magnetic Conference- (MMM-Intermag) ; Conference date: 07-01-2001 Through 11-01-2001",

year = "2001",

month = jul,

doi = "10.1109/20.950960",

language = "English",

volume = "37",

pages = "1761--1763",

journal = "IEEE Transactions on Magnetics",

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publisher = "Institute of Electrical and Electronics Engineers Inc.",

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TY - JOUR

T1 - Effects of impurities on resistivity of electrodeposited high-Bs CoNiFe-based soft magnetic thin films

AU - Osaka, Tetsuya

AU - Yokoshima, Tokihiko

AU - Nakanishi, Takuya

N1 - Funding Information: This work was supported by the Research for the Future Project “Advanced Research and Development on High Density Magnetic Recording Devices by means of Atomic Interface Design” of the Japan Society for the Promotion of Science and by the Storage Research Consortium (SRC).

PY - 2001/7

Y1 - 2001/7

N2 - Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-Bs CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

AB - Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-Bs CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

KW - Electrodeposition

KW - Impurities

KW - Organic additives

KW - Resistivity

KW - Soft magnetic thin films

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JO - IEEE Transactions on Magnetics

JF - IEEE Transactions on Magnetics

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