Efficient dummy filling methods to reduce interconnect capacitance and number of dummy metal fills

Atsushi Kurokawa*, Toshiki Kanamoto, Tetsuya Ibe, Akira Kasebe, Wei Fong Chang, Tetsuro Kage, Yasuaki Inoue, Hiroo Masuda

*Corresponding author for this work

    Research output: Contribution to journal › Article › peer-review

    2 Citations (Scopus)

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    Engineering & Materials Science