Elasto-Plastic-Creep Constitutive Equation of an Al-Si-Cu High-Pressure Die Casting Alloy for Thermal Stress Analysis

Yuichi Motoyama*, Hidetoshi Shiga, Takeshi Sato, Hiroshi Kambe, Makoto Yoshida

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Elasto-Plastic-Creep Constitutive Equation of an Al-Si-Cu High-Pressure Die Casting Alloy for Thermal Stress Analysis'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds